RF and Microwave Microelectronics P - E-book

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Rf And Microwave Microelectronics Packaging - ENG

Ken Kuang; ?Franklin Kim; ?Sean S. Cahill

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$3,180.00

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Sinopsis

ISBN:	9781441909848
Formato:	ePub
Idioma:	Inglés
Editorial:	Springer Nature
Tema:	Tecnología e ingeniería
Subtema:	Eletrónica general
Año de publicación:	2009-12-01

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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