The Source/drain Engineering Of Nanoscale Germanium-based Mos Devices - ENG
| ISBN: | 9783662496831 |
|---|---|
| Formato: | Page Fidelity |
| Idioma: | Inglés |
| Editorial: | Springer Nature |
| Tema: | Tecnología e ingeniería |
| Subtema: | Eletrónica semicondutores |
| Año de publicación: | 2016-03-24 |
This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With  adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600℃ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10−7Ω•cm2, respectively. Besides, a reduced  source/drain parasitic resistance is demonstrated in the  fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.










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