Wafer Level 3-D ICs Process Technol - E-book

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Wafer Level 3-d Ics Process Technology - ENG

Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif

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Sinopsis

ISBN:	9780387765341
Formato:	ePub
Idioma:	Inglés
Editorial:	Springer Nature
Tema:	Tecnología e ingeniería
Subtema:	Eletrónica general
Año de publicación:	2009-06-29

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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