3D Stacked Chips - E-book

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3d Stacked Chips - ENG

From Emerging Processes To Heterogeneous Systems

Ibrahim (Abe) M. Elfadel

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Sinopsis

ISBN:	9783319204819
Formato:	Page Fidelity
Idioma:	Inglés
Editorial:	Springer Nature
Tema:	Tecnología e ingeniería
Subtema:	Eletrónica circuitos
Año de publicación:	2016-05-11

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.Â The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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